This electrically conductive paste is a 2-part heat-cured epoxy with a long working time. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates.

This electrically conductive epoxy paste can be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. It provides excellent EMI/RFI shielding and is very effective in filling seams between metal plates.

8331S has been formulated to be economical. For a higher fill version that maximizes conductivity, use 8330S. For a shorter working time or room temperature cure, use 8331 or 8331D.