Slow Cure Thermally Conductive Adhesive
This high thermal conductivity adhesive paste is a 2-part epoxy with a long 4-hour working time. It is dark grey, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates.
Use this thermal adhesive paste to glue heat sinks to LEDs, CPUs, and other heat-generating components. This product is highly viscous and must be mixed by hand prior to application. We also offer a lower viscosity alternative (8329TFS) suitable for use with mixing tips.
This adhesive has been formulated to have a long working time. We also offer fast-curing alternatives with 5-minute (8329TCF), and 45-minute (8329TCM) working times. Electrically conductive alternatives (8331S and 8330S) and thermal pastes are also available.