Protect your devices with the LOCTITE 3549 reworkable epoxy underfill. Specially formulated to safeguard solder joints from induced stresses, this product significantly enhances both drop test and temperature cycle performance.

Product Benefits:

• Reworkable: Easy to rework, providing flexibility and convenience.
• Fast Flow: Ensures quick and efficient application.
• Low Temperature Cure: Suitable for a wide range of applications.
• High Adhesion: Bonds strongly to both flexible and rigid substrates.
• Excellent Protection: Shields solder joints against stresses, prolonging device lifespan.

Choose LOCTITE for superior performance and reliability in every application.