Loctite 452116 - Eccobond FP4460 Epoxy, Black, 30ml Syringe
LOCTITE® ECCOBOND FP4460 encapsulant is designed for the protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on the device and package type.
Specification:
- Coefficient of thermal expansion (CTE), Below Tg: 20.0 ppm/°C
- Color: Black
- Cure schedule, @ 150.0 °C: 3.0 hr.
- Cure type: Heat cure
- Glass transition temperature (Tg): 173.0 °C
- Operating temperature: -65.0 - 150.0 °C
- Specific gravity, @ 25.0 °C: 1.78
- Viscosity, Brookfield - RVF, @ 25.0 °C Spindle 7, speed 10 rpm: 300000.0 mPa·s (cP)