Epoxy-based formulation for a uniform and void-free encapsulant underfill.

When you want a second-level underfill for void-free encapsulation of electronic packages, choose LOCTITE ECCOBOND UF 1173. This 1-part, epoxy-based underfill maximizes the device's temperature cycling capability, distributing stress away from solder connects, thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173 has a long pot life and exhibits low-CTE properties to improve the bond strength and stability.