ECCOBOND UF 1173 Epoxy Underfill, 55cc Syringe
When you want a second-level underfill for void-free encapsulation of electronic packages, choose LOCTITE® ECCOBOND UF 1173. This 1-part, epoxy-based underfill maximizes the device's temperature cycling capability, distributing stress away from solder connects, thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE® ECCOBOND UF 1173 has a long pot life and exhibits low-CTE properties to improve bond strength and stability.