Eccobond UF 3912 Epoxy Underfill, 30cc Standard Cartridge, 10 per Case
The LOCTITE ECCOBOND UF 3912 underfill is specially designed for flip chip device applications.
Specifications:
Applications: Encapsulating, Underfilling
Coefficient of thermal expansion (CTE), Above Tg: 105.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg: 28.0 ppm/°C
Color: Black
Cure schedule, @ 160.0 °C: 7.0 min.
Cure type: Heat Cure
Glass transition temperature (Tg): 127.0 °C
Storage modulus, DMA @ 25.0 °C: 8100.0 N/mm²
Storage temperature: -40.0 °C
Viscosity, Brookfield CP51, @ 25.0 °C Speed 20 rpm: 3500.0 mPa·s (cP)