Loctite 2017490 - LOCTITE ECCOBOND UF 8830S Epoxy, Grey Paste, 10CC Syringe
LOCTITE ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and the narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.
When fully cured, this material forms a rigid, low-stress seal that dissipates stress in solder joints and extends thermal cycling performance.