Ablestik 2030SC Hybrid-Based Adhesive, 1cc/3cc Syringe
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
Specifications:
Applications: Die attach
Cure type; Heat cure
Extractable ionic content, Chloride (CI-): 19.0 ppm
Extractable ionic content, Potassium (K+): 4.0 ppm
Extractable ionic content, Sodium (Na+): 29.0 ppm
Hot die shear strength: 0.96 kg-f
RT die shear strength, 2 x 2 mm Si die on Pd: 1.9 kg-f
Tensile modulus, @ 250.0 °C: 450.0 N/mm² (65000.0 psi )
Thixotropic index: 4.6