• One component
• Thixotropic
• Fast cure at moderate temperatures
• Low Tg
• Low modulus

The LOCTITE ECCOBOND EN 3838T is designed to provide a flexible, low Tg material for encapsulating components on a PCB. When cured, this material provides physical protection and stable electronic performance and protection in temperature/humidity/bias testing.

Specifications:

Coefficient of thermal expansion (CTE), Above Tg: 217.0 ppm/°C

Coefficient of thermal expansion (CTE), Below Tg: 57.0 ppm/°C

Cure schedule, @ 130.0 °C: 8.0 min.

Cure type: Heat cure

Glass transition temperature (Tg): 2.0 °C

Viscosity, Brookfield CP51, @ 25.0 °C Speed 20 rpm; 6700.0 mPa·s (cP)