• Two components - requires mixing
• Low viscosity
• Thermal shock and impact resistant
• Low stress connections with no pistoning
• Room temperature cure or Heat cure

This low viscosity, 2-part non-conductive adhesive is specially formulated for fiber optic assembly applications. It is resistant to both thermal shock and impact.

If you’re looking for an electrically non-conductive adhesive for fiber optic assembly applications, try LOCTITE® ECCOBOND F 112. This 2-part low-viscosity product is thermal shock and impact-resistant and offers low-stress connections with no pistoning. It’s also ideal for multimode and single-mode connectors, and small potting and sealing applications.

Specifications:

Cure schedule, @ 25.0 °C: 1.0 hr.

Cure type: Heat cure

Number of components: 2 part

Shear strength, Aluminum: 3000.0 psi

Storage temperature: 27.0 °C

Thixotropic index: 1.0

Viscosity, @ 25.0 °C: 1800.0 mPa·s (cP)