ABLESTIK 2112 BIPAX, Epoxy, Non-Conductive Adhesive
The LOCTITE ABLESTIK 2112 BIPAX is recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications. LOCTITE ABLESTIK 2112 BIPAX is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications.
Specifications:
Cure schedule, Recommended @ 65.0 °C: 4.0 hr.
Cure type: Heat Cure
Number of components: 2 Part
Recommended for use with: Metal
Shear strength, Aluminum: 1900.0 psi
Storage temperature: 27.0 °C
Thixotropic index: 6.5
Viscosity, Brookfield, Spindle RV7, Speed 10 rpm: 60000.0 mPa·s (cP)