• Electrically conductive
• High thermal conductivity
• Solvent-free formulation
• Low viscosity
• 4.5pH

LOCTITE ABLESTIK 84-1LMIT1 is a silver-filled, epoxy adhesive material designed for medium die attach applications.

LOCTITE ABLESTIK 8175 is an electrically and highly thermally conductive material designed for screen printing with 325 mesh. This heat-curable, low-viscosity material is solvent-free and meets MIL-STD-883, Method 5011 requirements.

Specifications:

Application method: Dispense gun

Applications: Die attach

Cure schedule, @ 150.0 °C: 1.0 hr.

Cure type: Heat cure

Number of components: 1 part

Physical form: Paste

Shear strength, Aluminum: 1885.0 psi

Storage temperature: -40.0 °C

Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm: 22000.0 mPa·s (cP)

Volume resistivity: 0.0005 Ohm cm