ABLESTIK 84-1LMIT1 Epoxy Adhesive, Die Attach
LOCTITE ABLESTIK 84-1LMIT1 is a silver-filled, epoxy adhesive material designed for medium die attach applications.
LOCTITE ABLESTIK 8175 is an electrically and highly thermally conductive material designed for screen printing with 325 mesh. This heat-curable, low-viscosity material is solvent-free and meets MIL-STD-883, Method 5011 requirements.
Specifications:
Application method: Dispense gun
Applications: Die attach
Cure schedule, @ 150.0 °C: 1.0 hr.
Cure type: Heat cure
Number of components: 1 part
Physical form: Paste
Shear strength, Aluminum: 1885.0 psi
Storage temperature: -40.0 °C
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm: 22000.0 mPa·s (cP)
Volume resistivity: 0.0005 Ohm cm