ABLESTIK 8700K Epoxy Adhesive, Die Attach
This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.
LOCTITE ABLESTIK 8700K is an epoxy, heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping.
Specifications:
Applications: Die attach
Coefficient of thermal expansion (CTE): 20.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg: 55.0 ppm/°C
Color: White
Cure schedule, @ 175.0 °C: 1.0 hr.
Cure type: Heat cure
Glass transition temperature (Tg): 165.0 °C
RT die shear strength, 2 x 2 mm on Gold: 5000.0 kg-f
Thermal conductivity: 0.5 W/mK
Viscosity, @ 25.0 °C: 45000.0 mPa·s (cP)
Volume resistivity: 3x10¹⁴ Ohm cm