ABLESTIK 84-1LMI Epoxy Adhesive, 1cc Syringe, 324 per Case
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by an automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
Specifications:
Applications: Die attach
Cure schedule, @ 150.0 °C: 1.0 hr.
Cure type: Heat cure
Number of components: 1 part
Physical form: Paste
Shear strength, Aluminum: 1500.0 psi
Storage temperature: -40.0 °C
Thixotropic index: 4.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm: 30000.0 mPa·s (cP)
Volume resistivity: 0.0005 Ohm cm