Kester R562 Solder Paste
Kester R562 Solder Paste is an organic acid, water-soluble solder paste specifically designed for resistance to environmental extremes. Water soluble pastes tend to dry out in low relative humidity and slump at high relative humidity. R562 will maintain its print characteristics, tack, and activity even after exposure to environmental extremes.
Performance Characteristics:
- Reduces BGA voiding to <3%
- Bright, shiny joints
- 12-hour stencil life
- Print speeds up to 6 in/sec
- Compatible with enclosed print head systems
- Consistent printing over a range of temperatures and humidity
- Capable of multiple reflow profiles before a cleaning operation is required
- Excellent solderability to a wide variety of metallizations, including Palladium
- Residues are easily removed with hot DI water within 8 hours as best practice after processing
- Classified as ORM0 per J-STD-004
- Capable of off-pad printing with no solder balls after reflow dry out
Standard Applications:
- Stencil Printing: 90% Metal
- Enclosed Head Printing: 90% Metal
RoHS Compliance
Kester does not determine any applicable Restriction of Hazardous Substances (RoHS) exemptions for our lead-containing products at the user level.