• 268 Flux-Cored Wire
• Alloy: Sn63Pb37
• Flux: 268
• Diameter (in): 0.031
• Core: 66

Kester 268 Flux-Cored Wire is a zero-halogen wire optimized for robotic soldering applications. With its unique chemistry system, 268 provides consistent workability performance for both robotic and manual soldering in the electronics industry, with performance equivalent to conventional halogen/halide-based systems. 268 provides a clean release that prevents the occurrence of bridges and protrusions, even in narrow-pitch automated drag soldering. The use of 268 results in a clear post-soldering residue without the need for cleaning. 268 is classified as Type ROL0 flux under J-STD-004B specifications. 268 is zero-halogen and halide-free with no intentional addition of bromine or chlorine, conforming to the strictest requirements of IEC 61249-2-21, JPCA-ES-01, and IPC-410B specifications.

• Low occurrence of solder ball spatter
• Conforms to the halogen-free requirement of IEC 61249-2-21, JPCA-ES-01, and IPC-410B specifications with no intentionally added halogens and halides.
• Low smoke and odor
• Excellent wetting speed and spread; superior to halogenated materials
• Clear residue, resulting in excellent joint aesthetics after soldering
• Excellent surface wettability and spreading suitable for robotic soldering and manual soldering
• Excellent manufacturing consistency and uniform quality, minimizes defects for all types of soldering
• Classified as ROL0 per J-STD-004B

This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC, Article 4 for the stated banned substances. (This only applies if this core flux is combined with a lead-free alloy.)

268 is available in SAC 305 and K100LD lead-free alloys and Sn63Pb37 in 3.3% flux on a robotic spool. For low-cost, lead-free soldering applications, the K100LD alloy is ideal. Wire diameters typically range from 0.25 to 1.6 mm (0.010 to 0.062 in).

268 possesses excellent fluxing ability. The flux residues are non-corrosive and non-conductive and do not require removal for most applications under normal conditions of use. IPA will not clean the residues off the surface of the circuit board after the soldering process. If removal is required, a saponifier or cleaning agent specifically designed to clean a no-clean flux is required to clean the residues. Please contact Kester Technical Support for further information.