186 Flux-Pen, Rosin
Kester 186 Flux-Pen is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. 186 Flux-Pen under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive. 186 Flux-Pen has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux.
186 Flux-Pen possess high thermal stability for soldering multi- layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive.
Flux Application
186 Flux-Pen is applied to circuit boards via Flux-Pen for rework of printed wire assemblies.
Process Considerations
186 Flux-Pen should only be applied to areas that will be fully heated by the soldering iron or other reflow tool. Care should be taken to avoid flooding the assembly. The surface tension has been adjusted to help the flux form a thin film on the board surface allowing rapid solvent evaporation.
Cleaning
186 Flux-Pen flux residues are non-conductive, non-corrosive and do not require removal in most applications.