• NP560 Solder Paste
• Package Type: 100g Syringe
• Alloy: Sn96.5Ag3.0Cu0.5
• Powder Size: 4
• Type: No-Clean

NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in the air, with minimal graping behavior. In addition to its stable, consistent product performance, the NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.

• Classified as ROM0 per IPC J-STD-004B
• Halogen-Free
• Low voiding potential under QFNs
• Excellent activity and printability
• Very low graping
• Reflowable in air and nitrogen conditions
• Wide reflow profile window with good solderability on various PCB surface finish

This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive.

NP560 is available in Sn96.5Ag3Cu0.5 alloy with Type 3 (T3), Type 4 (T4), and Type 5 (T5) powder mesh. Type 4 mesh size is recommended for standard and fine-pitch applications. Type 5 is recommended for ultra-fine pitch applications. NP560 is also compatible with other SnAgCu alloys in a similar melting range to the listed alloy. For specific packaging information, refer to this product’s Product Offerings tab at kester.com for available sizes. The appropriate combination depends on the process variables and the specific application.

NP560 residues are non-conductive and non-corrosive and do not require removal. If it is desired to remove the residues, a commercially available residue cleaner may be used. Contact Kester Technical Support for additional assistance.