R231 Solder Paste, Sn63Pb37, Rosin, Leaded, 500g Jar
Kester R231 is a Mildly Activated Rosin (RMA) solder paste formula specifically designed to exhibit long stencil/print life. R231 maintains its activity and printing characteristics for up to 8 hours (temperature and humidity dependent).
Performance Characteristics:
- High print speeds to 200 mm/sec (8 in/sec)
- Compatible with 0201 technology
- Excellent printing characteristics to 0.4mm (16-mil) pitch with Type 3 powder
- Excellent wetting on a variety of substrates, including OSPs
- Capable of 90-minute break times in printing
- Stencil life: 8+ hours (process dependent)
- Scrap is reduced due to less paste drying out
- Stable tack over 8+ hours
- Classified as ROL0 per J-STD-004
- Compatible with DEK ProFlow and MPM RheoPump enclosed print head systems
Standard Applications:
- Stencil Printing - 90% Metal
- Enclosed Head Printing - 90% Metal
Availability
Kester R231 is available in the Sn63Pb37 and Sn62Pb36Ag02 alloys with Type 3 powder. Type 3 powder mesh is recommended, but different powder particle size distributions are available for standard and fine-pitch applications. The appropriate combination depends on process variables and the specific application.
Cleaning
R231 is an RMA formula. The residues do not need to be removed for typical applications. Although R231 is designed for RMA applications, its residues can be easily removed using automated cleaning equipment (in-line or batch) with a variety of readily available cleaning agents. Call Kester Technical Support for details.