• FL250D Solder Paste
• Package Type: 600g Cartridge
• Alloy: Sn63Pb37
• Powder Size: 3
• Type: No-Clean

Kester FL250D is a no-clean, air- or nitrogen-reflowable solder paste specifically designed for automotive requirements. FL250D is compatible with post-soldering process chemicals, including conformal coatings and potting compounds. FL250D is capable of stencil printing downtimes of up to 90 minutes with an effective first print at 20 mils. FL250D also has the capability of printing at up to 8in/sec (200 mm/sec) with squeegees or within an enclosed head.

• Excellent residue characteristics that are completely compatible with conformal coating and potting processes
• High print speeds to 200 mm/sec (8 in/sec)
• Compatible with 0201 technology
• Excellent printing characteristics to 0.4 mm (16 mil) pitch with Type 3 powder
• Excellent wetting on a variety of substrates, including OSPs
• Capable of 90-minute break times in printing
• Stencil life: 8+ hours (process dependent)
• Scrap is reduced due to less paste drying out
• Stable tack over 8+ hours
• Classified as ROL0 per J-STD-004
• Compatible with DEK ProFlow and MPM RheoPump enclosed print head systems

• Stencil Printing: 90% Metal
• Enclosed Head Printing: 90% Metal 

Kester FL250D is available in the Sn63Pb37 and Sn62Pb36Ag02 alloys with Type 3 powder. Type 3 powder mesh is recommended, but different powder particle size distributions are available for standard and fine-pitch applications. For specific packaging information, see Kester's Solder Paste Packaging Chart for available sizes. The appropriate combination depends on process variables and the specific application.

FL250D is a no-clean formula. The residues do not need to be removed for typical applications. Although FL250D is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line or batch) and a variety of readily available cleaning agents. Call Kester Technical Support for details.