NP505-LT Solder Paste, Sn42Bi57Ag1, No-Clean, Lead-Free, 500g Jar
NP505-LT is a no-clean, Pb-free, zero-halogen solder paste for assemblies that have temperature-sensitive substrates and components. Warping is becoming more evident with the trend towards complex boards and the trend of using thinner and larger packages and boards. The defects caused by the warpage may decrease board reliability and increase rework. NP505-LT is designed to reduce warpage inherent to board-to-package. NP505-LT is classified as ROL0.
Performance Characteristics:
- Zero-Halogen (none intentionally added)
- Low reflow peak temperatures (175 to 215 °C)
- Reduced reflow temperatures improving efficiency in energy and cost
- Reduction in board-to-package warpage
- Low voiding potential under QFNs (< 15%)
- Wide reflow profile window with good solderability on various PCB surface finish
- Excellent activity and printability
- Extremely stable paste properties
- Colorless residues for easy post-reflow inspection
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive.
Availability
NP505-LT is available in Sn42Bi57Ag01 alloy with type 4 powder mesh (20 to 38µm). Type 4 mesh size is recommended for standard and fine pitch applications. NP505-LT standard packaging in 500gm jars and 600gm cartridges. The appropriate combination depends on the process variables and the specific application. If other packaging configurations are needed, please contact your Kester representative for additional information.
Cleaning
NP505-LT residues are non-conductive, non-corrosive, and do not require removal. If it is desired to remove the residues, a commercially available residue cleaner may be used. Contact Kester Technical Support for additional assistance.