NXG1 Solder Paste, Sn63Pb37, No-Clean, Leaded, 600g Cartridge
Kester NXG1 is a lead-free, no-clean solder paste designed to be used in air and nitrogen atmospheres and handle the thermal requirements of lead-free alloys. The paste flux system allows joint appearances that closely resemble those achieved with SnPb alloys. The NXG1 is capable of stencil printing downtimes of up to 120 minutes with an effective first print down to 0.4mm (16 mil) pitch QFPs. NXG1 also offers excellent cosmetic appearance in the reflowed solder joints, with smooth, shiny solder and light-colored residues. This paste also features the longest shelf life of any product in its class at 8 months. NXG1 is ANSI/J-SDTD-005 compliant. The flux as per IPC ANSI/J-STD-004B is classified as ROL1.
Performance Characteristics:
- Excellent wetting to a variety of metals
- Capable of print speeds up to 25 to 200 mm/sec (1 to 8 in/sec)
- Resistant to slump
- Shelf life is 8 months
- Excellent printing characteristics on 0.4 mm (16 mil) pitch QFPs
- Long stencil and tack life (process dependent)
- Excellent release from stencil
- Capable of 120 minute break times in printing
- Clean cosmetic aesthetics after reflow
- Reflowable in air or nitrogen
Standard Applications:
- For stencil printing: 88.5% metal for -3.05+500 mesh
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2011/65/EU for the stated banned substances.
Availability
NXG1 is available in SAC305 alloys with Type 3 powder mesh size for standard and fine pitch applications. The appropriate combination depends on process variables and the specific application.
Cleaning
NXG1 is a no-clean formula. The residues do not need to be removed for typical applications. Although NXG1 is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line or batch) with a variety of readily available cleaning agents. If residue removal is required, call Kester Technical Support.