NXG1 Solder Paste, No-Clean, Lead-Free, 500g Jar
The NXG1 Solder Paste is a lead-free, no-clean solder paste designed to be used in air and nitrogen atmospheres and handle the thermal requirements of lead-free alloys. The paste flux system allows joint appearances that closely resemble those achieved with SnPb alloys. The NXG1 is capable of stencil printing downtimes of up to 120 minutes with an effective first print down to 0.4 mm (16 mils) pitch QFPs. NXG1 also offers an excellent cosmetic appearance in the reflowed solder joints, with smooth, shiny solder and light-colored residues. This paste also features the longest shelf life of any product in its class at 8 months. NXG1 is ANSI/J-SDTD-005 compliant. The flux as per IPC ANSI/J-STD-004B is classified as ROL1.
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2011/65/EU for the stated banned substances.