R500 Solder Paste, Sn63Pb37, Water-Soluble, Leaded, 100g Syringe
Kester R500 is a water-soluble solder paste formula specifically designed as a consistent dot dispensing paste for automated dispensing equipment. This solder paste exhibits excellent wetting characteristics in a wide range of profiles. The activator package in this formula is extremely aggressive. It is active enough to remove tenacious oxide layers or to solder to OSP-coated boards. R500 is a water-soluble formula that maintains its activity and tackiness characteristics for up to 8 hours.
Performance Characteristics:
- Excellent dispensing characteristics using 21 gauge needles and Type 3 powder
- Capable of dispensing rate of 4 dots per second
- Leaves bright/shiny solder joints after reflow
- Scrap is reduced due to minimal paste clogging and separation
- Residues are easily removed with DI water
- Classified as ORM0 per J-STD-004
Standard Applications:
86% Metal - Syringe Dispensing
Availability
Kester R500 is available in SAC305 and Sn63Pb37 alloys with Type 3 powder.
Cleaning
R500 residues are best removed using automated cleaning equipment (in-line or batch). Deionized water is recommended for the final rinse. Water temperatures should be 49 to 60 °C (120 to 140 °F). In addition, Kester's 5768 Bio-Kleen saponifiers can also be used in a 1 to 2% ratio for aqueous cleaning systems.