R276 Solder Paste, Sn63Pb37, No-Clean, Leaded, 100g Syringe
Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is available in Sn63Pb37 and Sn96.5Ag3.0Cu0.5 alloys. The flow characteristics of R276 provide for excellent dispensing characteristics with a wide range of needle diameters. R276 is classified as ROL0.
Performance Characteristics:
- Available with leaded and lead-free alloys
- Compatible with Kester EP256 stenciling solder paste
- Classified as ROL0 per J-STD-004
- Compliant to Bellcore GR-78
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive. Additional RoHS information is located at https://www.kester.com/downloads/environmental.
Availability
R276 is available in Sn63Pb37, Sn96.5Ag3.0Cu0.5, Sn43Pb43Bi14, Sn10Pb88Ag2, Sn95.5Ag3.8Cu0.7, and Sn62Pb36Ag2 alloys with the recommended Type 3 powder mesh.
Cleaning
R276 is a no-clean formula. The residues do not need to be removed for typical applications. Although R276 is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line or batch) with a variety of readily available cleaning agents. Call Kester Technical Support for details.