EM907 Solder Paste, No Clean, Lead-Free, 600g Cartridge
EM907 Solder Paste is a lead-free, no-clean, air and nitrogen reflowable solder paste specifically designed for the thermal requirements of lead-free alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The paste flux system allows joint appearances that closely resemble those achieved with SnPb alloys. EM907 is capable of stencil printing downtimes of up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4 mm/16 mils) and can print at high speeds up to 6 in/s (150 mm/s).
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2015/863 for the stated banned substances.