EM828 Solder Paste, Sn96.5Ag3.0Cu0.5, Water-Soluble, Lead-Free, 500g Jar
Kester EM828 is a lead-free, water-soluble solder paste formulated specifically to reduce the voiding behavior that is common with lead-free solder paste products. EM828 represents a breakthrough in water-soluble solder paste technology with the combination of low voiding, excellent wetting behavior, and ease of cleaning. Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time, or throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.
Performance Characteristics:
- Low-voiding underneath area array components
- Excellent wetting on a variety of metallizations
- Residues are easily removed in hot DI water
- Long stencil life and tack time (process dependent)
- Tremendous brick definition and slump resistance for reduction of bridging defects
- Print speed up to 150 mm/second (6 inch/second)
- Capable of breaks in the printing of up to 60 minutes without any kneading
- Classified as ORH1 per J-STD-004A
Standard Applications:
- Stencil Printing: 89.5% Metal
- Enclosed Head Printing: 89.5% Metal
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS), 2002/95/EC Article 4 for the stated banned substances.
Availability
Kester EM828 is available in the Sn96.5Ag3.0Cu0.5 alloy with Type 3 and Type 4 powder. Type 3 powder mesh is recommended; however, Type 4 powder is available for finer pitch applications. The appropriate combination depends on process variables and the specific application.
Cleaning
EM828 residues are best removed using automated cleaning equipment (in-line or batch) within 48 hours of soldering. De-ionized water is recommended for the final rinse. Water temperatures should be 49 to 60 °C (120 to 140 °F). In addition, Kester's 5768 Bio-Kleen saponifiers can also be used in a 1 to 2% ratio for aqueous cleaning systems.