EP256HA Solder Paste, No-Clean, Leaded, 600g Cartridge
EP256HA is a no-clean, air or nitrogen reflowable solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. The EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder components and board surface metalizations. EP256HA is also capable of stencil printing after downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning. EP256HA is classified as ROL0.
Performance Characteristics:
- Excellent solderability on difficult to solder to components, i.e., PdAg
- High activity on all substrates, including OSPs
- Capable of 90-minute break times in printing
- Excellent printing characteristics to 0.4 mm (16 mil) pitch with Type 3 powder
- High print speeds to 150 mm/sec (6 in/sec)
- Stable tack over 8+ hours
- Stencil life: 8+ hours (process dependent)
- Scrap is reduced due to less paste dry out
- Classified as ROL0 per J-STD-004
RoHS Compliance
Kester does not determine any applicable Restriction of Hazardous Substances (RoHS) exemptions for our lead-containing products at the user level.
Availability
EP256HA is commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh is recommended, but different powder particle size distributions are available for standard and fine pitch applications. The appropriate combination depends on process variables and the specific application.
Cleaning
EP256HA is a no-clean formula. The residues don’t need to be removed for typical applications. Although EP256HA is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line or batch) with a variety of readily available cleaning agents. Call Kester Technical Support for details.