EP256HA Solder Paste, No-Clean, Leaded, 500g Jar
EP256HA Solder Paste is a no-clean, air or nitrogen reflowable solder paste created primarily to give optimal print qualities and solderability on lead-free components utilizing leaded solder paste. The EP256HA was created for applications requiring the highest level of activity with difficult-to-solder components and board surface metallizations.
EP256HA is also capable of stencil printing after downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.
RoHS Compliance
Kester does not determine any applicable Restriction of Hazardous Substances (RoHS) exemptions for our lead-containing products at the user level.