Kester 70-0202-0311 - Solder Paste, No-Clean, Leaded, Sn63Pb37, T3, 90%, 500g Jar

Name: Kester 70-0202-0311 - Solder Paste, No-Clean, Leaded, Sn63Pb37, T3, 90%, 500g Jar
Brand: Kester
SKU: Kester70-0202-0311
Price: 1700.00 USD
Availability: InStock

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EP256HA Sn62Pb36Ag2 T3 90% 600g CRT-Note:Price is for 10 Units

Excellent solderability on difficult to solder to components, i.e., PdAg
High activity on all substrates, including OSPs
Capable of 90-minute break times in printing
Excellent printing characteristics to 0.4 mm (16 mil) pitch with Type 3 powder
High print speeds to 150 mm/sec (6 in/sec)
Stable tack over 8+ hours
Stencil life: 8+ hours (process dependent)
Scrap is reduced due to less paste dry out
Classified as ROL0 per J-STD-004

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Kester 70-0202-0311 - Solder Paste, No-Clean, Leaded, Sn63Pb37, T3, 90%, 500g Jar

Kester EP256HA is a no-clean, air or nitrogen reflowable solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metalizations. EP256HA is also capable of stencil printing after downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning. EP256HA is classified as ROL0.