Solder Analysis Program Option C
Kester's solder analysis program is a prepaid method for rapid response solder sample analysis. It allows customers to document solder pot impurities for conformance to Federal Specifications or ISO quality requirements. Option C: This option includes monitoring tin, antimony, copper, gold, lead, cadmium, aluminum, zinc, iron, arsenic, bismuth, silver, and nickel. Includes mailer and assigned controlled document instruction sheet.
Tests for impurity levels of Tin (Sn), Antimony (Sb), Copper (Cu), Gold (Au), Cadmium (Cd), Zinc (Zn), Aluminum (Al), Iron (Fe), Arsenic (As), Bismuth (Bi), Silver (Ag), Nickel (Ni), and Lead (Pb).