Kester TSF-6592HF is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications. 

TSF-6592HF is designed for stencil/screen printing, rotating drum, slide fluxers and/or syringe

applications. This flux is great for rework applications on all PCB packages of various electronic

devices. TSF-6592HF can be used in BGA/PGA sphere/pin attachment vehicle or for repair and

reballing/repinning. This flux works on flip chip, chip scale package and flip chip bumping sites

assemblies as a soldering paste flux.