Kester 300303 - TSF-6592LV Lead-free No-clean Tacky Flux, 30 Grams Syringe

Name: Kester 300303 - TSF-6592LV Lead-free No-clean Tacky Flux, 30 Grams Syringe
Brand: Kester
SKU: Kester300303
Price: 56.00 USD
Availability: InStock

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TSF-6592LV Lead-free no-clean tacky flux, 30 grams syringe

30 Grams syringe
Compatible with Lead Free alloys such as SnAg, SnCu, SnAgCu, SnAgBi
Reflow-able with peak temperatures up to 270 °C
Reflow-able in air and nitrogen
Bright shiny soldered joints with clear residues
Aggressive flux on various substrates such as OSP-Cu, Immersion finishes and ENIG
Clear non-tacky residues
High tack to minimize skewing of components
Low voiding
Stencil life of 8+ hours (process dependent)

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Kester 300303

30 Grams syringe
Compatible with Lead-Free alloys such as SnAg, SnCu, SnAgCu, SnAgBi
Reflow-able with peak temperatures up to 270 °C
Reflow-able in air and nitrogen

TSF-6592LV Lead-free No-clean Tacky Flux, 30 Grams Syringe

Kester 300303 TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip-chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high-speed printing applications.