• 30 Grams syringe
• Stencil life: 8 hours (process dependent)
• Excellent printing characteristics to <16mil pitch
• Leaves bright/shiny solder joints after reflow

Kester 300103 TSF-6502 is a no-clean tacky soldering flux formula that possesses a high activity level, allowing it to solder nickel surfaces. The robust wetting action of TSF-6502 will allow OSP-treated copper, as well as heavily oxidized copper, surfaces to exhibit good soldering properties, even after 2 or 3 thermal cycles. Following reflow, TSF-6502 will leave an aesthetically pleasing clear residue on the assembly. TSF-6502 is designed for a wide range of temperature and humidity conditions.