245 Flux-Cored Wire

Kester 245 was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 245 results in visually acceptable assemblies without cleaning, yet soldering quality and efficiency are comparable to that obtained with mildly activated rosin flux. 245 is classified as ROL0 per J-STD-004. 245 is Bellcore GR-78 compliant.

Performance Characteristics

• Highy reliable post-soldering residue
• Minimal residue
• Compatible with leaded and lead free alloys
• Classified as ROL0 per J-STD-004

The 245 flux residues are non-corrosive, non-conductive and do not require removal in most applications. IPA will not clean the residues off the surface of the circuit board after the soldering process. A saponifier or cleaning agent specifically designed to clean a no-clean flux is required to clean the residues.

Kester 245 Flux-Core Solder Wire Comparison Table Click here.