Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 275 No-Clean Flux results in an extremely clear post-soldering residue without cleaning. The unique chemistry in 275 was also designed to reduce spattering common to most core fluxes. 275 can be used for both lead-free and leaded soldering. 275 is classified as ROL0 per J-STD-004.

• Colorless translucent residues
• Improves wetting performance
• Excellent solderability and fast wetting to a variety of surface finishes
• Eliminates the need and expense of cleaning
• Low smoke and odor
• Low spattering
• Compatible with lead-free and leaded alloys
• Classified as ROL0 per J-STD-004
• Compliant to Bellcore GR-78

The 275 flux residues are non-corrosive, non-conductive and do not require removal in most applications. IPA will not clean the residues off the surface of the circuit board after the soldering process. If removal is required, a saponifier or cleaning agent specifically designed to clean a no-clean flux is required to clean the residues.

Kester 275 Flux-Core Solder Wire Comparison Table Click here