ALPHA Exactalloy Preforms in tape and reel packaging provide an easy to implement method for controlling or increasing solder volume. Tape and reel preforms are specifically targeted at electronic assembly applications. These solder rectangles do not contain flux but rely on paste flux dispensed during the assembly process; or in the case of PCB assembly rely on flux present in solder paste to support reflow. Solder rectangles in tape and reel packaging are placed with standard pick and place equipment. The wide selection of sizes provides maximum flexibility and cost effectiveness since a single preform can usually be chosen to provide exactly the solder volume needed.

With electrical components sizes becoming ever smaller, printing sufficient amounts of solder paste onto miniaturized, overpopulated PCBs has become increasingly challenging. ALPHA Exactalloy Tape and Reel Preforms are specifically designed to overcome these solder volume deficiencies, enhancing the solder joint strength and reliability and providing 100% hole fill.

ALPHA Exactalloy Preforms in tape and reel packaging provide an easy to implement method for increasing the solder volume of SMT and through-hole components assembled using surface mount technology.

Specifically targeted for use with solder paste in SMT assembly applications, small solder rectangles are inserted into solder paste to precisely increase solder volume, the solder paste acting as both an adhesive and flux vehicle. The solder rectangles are 100% alloy, and due to the minimal amount of solder paste required to provide adequate wetting, near zero flux residue is realized.

The entire family of solder rectangles in tape and reel packaging are placed with standard pick and place equipment, utilizing industry standard chip capacitor size preforms for ease of use.