Wafer Level Reliability Option to ACS

Keithley has taken the power of its Automated Characterization Suite (ACS) software and focused it on wafer level reliability (WLR) testing. ACS-2600-RTM is an option to ACS that leverages the measurement speed and system integration capabilities of Keithley’s Series 2600A System SourceMeter instruments. The result—you can produce lifetime predictions from two to five times faster than you can with conventional WLR test solutions, allowing you to accelerate your technology development, process integration, and process monitoring for faster time to market.

With the ACS-2600-RTM option, ACS offers comprehensive single- and parallel-device WLR testing capability. Integrated with our innovative 2600A SourceMeter instruments, your WLR system will provide unmatched testing speed and accuracy via an SMU-per-pin architecture. A single 2600A dual-channel source measurement unit (SMU) is suitable for single-device reliability testing. Or take advantage of the TSP-Link®  bus on the 2600A instruments for systems with as many as 44 SMU channels (2 for each 2600A) for testing large numbers of devices in parallel and increasing overall system productivity. In addition to precise low-level measurements, the 2600A instruments can supply high voltage (200V) and high current (1.5A) sourcing and measurement to every test structure pad. This maximizes system flexibility, so you don’t need one solution for gate oxide integrity and a different system for metal interconnect reliability. Looking for a complete system solution? Keithley offers ACS with its highly configurable S500 Integrated Test Systems and application development services.

Extensive Software Capabilities

No coding is required to take full advantage of the source-measure capability of the 2600As or the tools included in the ACS software environment. The ACS-2600-RTM option provides a powerful stress/ measure sequencing tool with an interactive interface for testing device reliability, gate oxide integrity, and metal interconnects (EM). Its flexible test sequencing capabilities support pre- and post-testing, as well as intra-stress testing and stress monitoring. During testing, you can log raw reliability data into the database and/or plot it in real time. This real-time plotting provides a “sneak peek” at a test’s outcome to let you know whether time-consuming tests are on track to deliver meaningful results. After testing, use the easy point-and-click analysis offered by the integrated Formulator, which is populated with standard parametric extraction calculations. In addition, a variety of modeling, line fitting, and standard math functions allow custom data manipulation without programming.

Data Analysis Capabilities

• Standard analysis, including: normal fitting, curve fitting, acceleration, and distribution models such as Lognormal and Weibull
• Formulator tool that performs advanced functions, including: modeling, line-fitting, standard parametric extractions, and standard math functions for custom data manipulation
• Ability to reorganize and edit existing models to create new analysis processes
• Built-in scripting language that makes it easy to define your own models

APPLICATIONS

• Device reliability
  – HCI, NBTI, PBTI
• Gate oxide integrity
  – TDDB, V RAMP , J RAMP
• Metal interconnect
  – Isothermal electromigration
  – Poly heater
  – Constant current
  – ILD TDDB