| Specifications |
| Selectable parameters |
| Temperature |
90 to 450 °C / 190 to 840 °F |
| Dynamic Soldering Profiles |
Designed to avoid thermal shock when soldering Ceramic Chip components like MLCC, this new and unique feature allows controlling the heating ramp up rate of the tool to gradually increase the temperature of the component through all the phases of the soldering process. Up to 25 fully configurable soldering profiles can be stored. |
| Special features |
| Sleep and Hibernation mode |
These modes lower soldering tip temperature when the tool rests in the stand in order to avoid oxidation and extending tip life. |
| Max. and min. temperature |
Limit the temperature range in which the operator is allowed to work. |
| Temperature levels |
Instant selection of up to 3 editable temperature settings for solder joints with different heat requirement. |
| Soldering graphics |
Real time visualization of tip temperature and power delivered to the solder joint during soldering process. |
| PIN protection |
Keep station parameters protected against unauthorized access. |
| 10 user interface languages |
English, German, Spanish, French, Italian, Portuguese, Russian, Japanese, Korean, Chinese. |
| Connectivity |
| USB-B (rear) |
Software PC / Traceability |
| USB-A (front) |
Firmware update Soldering Graphics management |
| Robot |
RS-232 remote control or Smart Fume Extractor connection. |
| Pedal ( 1 per tool) |
Connect a pedal (ref.P-005) to control the tools. It allows using Nano tweezers for soldering. |
| Equipotential bonding |
| ESD/EOS |
| ESD safe |
| Tip to ground resistance |
< 2 ohms |
| Tip to ground voltage |
< 2 mV RMS |
| Power supply |
| Peak power |
14 W per tool - 8.5 V |
| Ambient operating temp. |
10 to 40 °C / 50 to 104 °F |
| Dimensions and weight |
| Control Unit |
170 x 90 x 135 mm / 2.50 kg (6.7 x 3.5 x 5.3 in / 5.40 lb) |
| Package |
280 x 280 x 164 mm / 2.94 kg (11.0 x 11.0 x 6.5 in / 6.49 lb) |