Indium Solder Paste (No-clean, halogen-free); SN63 (Sn63/Pb37); T.3 Powder, 0.9 metal load; 500g jar
Solder Paste
Indium Corporation’s high-quality solder pastes are uniquely formulated to provide superior performance and satisfy various assembly requirements.
Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage-induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.
Leading Print Performance on Miniaturized Components
The oxidation-inhibiting properties of Indium10.1 solder pastes promote industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 solder paste makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations.
Indium10.1 solder paste enables the lowest cost of ownership to PCB assembly manufacturers through an all-around balanced performance in both high print and soldering yields. It boasts a versatile, well-balanced set of properties with best-in-class printing and soldering performance. Indium10.1 solder paste provides industry-leading print definition and transfer efficiency, low voiding performance, and head-in-pillow and graping resistance.
Indium10.1 works best in applications that require:
- Wetting performance on difficult-to-solder or oxidized metallizations
- Low BTC voiding
- Outstanding HIP performance