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Indium PASTEOT-801274-600G - Indium 10.8HF Ultra-Low Voiding Pb-Free Solder Paste – SAC305, T4 (89 Percent); 600g Cartridge

Name: Indium PASTEOT-801274-600G - Indium 10.8HF Ultra-Low Voiding Pb-Free Solder Paste – SAC305, T4 (89 Percent); 600g Cartridge
Brand: Indium
SKU: IndiumPASTEOT-801274-600G
Price: 698.31 USD
Availability: InStock

0 reviews | Model: Indium PASTEOT-801274-600G

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10.8HF Pb-free solder paste; SAC305; Type 4 (89 percent metal load); 600g cartridge-Note:Price is for 3 Units

Alloy: SAC305
Type 4 powder (89 percent metal load)
Quantity: 600g cartridge
Addresses non-wet opens (NWOs)
Excellent non-wet open and HIP resistance
Low voiding on BGA/CSP/QFN
Outstanding print transfer and response-to-pause performance
Excellent wetting to all fresh and aged surface finishes, including, but not limited to: OSP, Immersion Ag, Immersion Sn, ENIG
Good all-around balanced performance
Clear post-reflow residue

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Product	Indium PASTEOT-801274-600G 10.8HF Pb-free solder paste; SAC305; Type 4 (89 percent metal l ...	Indium PASTEOT-801553-600g 10.8HF Pb-Free solder paste; SAC305 (96.5Sn/3.0Ag/0.5Cu); Type ...
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Indium PASTEOT-801274-600G

Alloy: SAC305
Type 4 powder (89 percent metal load)
Quantity: 600g cartridge
Addresses non-wet opens (NWOs)
Excellent non-wet open and HIP resistance

Indium 10.8HF Ultra-Low Voiding Pb-Free Solder Paste – SAC305, T4 (89 Percent); 600g Cartridge

As a leader in soldering technology, Indium Corporation offers a number of solder pastes for Pb-free assembly. Indium offers many different alloy choices and flux technologies to solve many of your process challenges.

Indium Corporation’s Pb-free solder pastes are ideal for miniaturized components and fine-pitch assembly. They provide first-class printing and robust reflow performance and are all designed to AVOID THE VOID®.

Avoid the Void

Avoid shortened product life; avoid field failures; avoid customer dissatisfaction, plus a whole lot more with Indium Corporation’s advanced solder paste technology.

Indium Corporation’s suite of solder pastes offers formulations designed to deliver low-voiding, plus enhanced benefits such as improved response-to-pause, stability, HiP minimization, reliable in-circuit testing, and enhanced SIR performance.

Indium 10.8HF

Indium10.8HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium10.8HF offers unprecedented stencil print transfer efficiency to work in the broadest range of processes

Indium10.8HF Pb-Free Solder Paste Addresses Non-Wet Opens (NWOs)

Indium10.8HF solder paste enables low cost-of-ownership to PCB assembly customers through an all-around balanced performance, including stencil printing yields, voiding, and soldering yields.

Indium10.8HF is versatile, with a balanced set of properties:

Meets leading OEM standards for non-wet open resistance
Oxidation barrier technology delivers strong resistance to:

Head-in-pillow defects
Graping (non-coalescence of powder particles)

Strong surface oxide cleaning and pad wetting during reflow ramp
Low voiding on BGSs, CSPs, and QFNs
Outstanding printing performance with high transfer efficiency and low variability
Excellent response-to-pause

Indium10.8HF works best in applications that require:

Warpage induced defect elimination; such as non-wet open and HIP. These are typically BGA microprocessors with thin core substrates and high IO counts that are found in PCs and tablets.

Compatible Products

Rework Flux: TACFlux 020B, TACFlux 089HF
Cored Wire: CW-807
Wave Flux: WF-9945, WF-9958

Storage and Handling Procedures

Refrigerated storage will prolong the shelf life of solder paste. Solder paste packaged in syringes and cartridges should be stored tip down.

Packaging	Storage Conditions (unopened containers)	Shelf Life
Syringe	<-10°C	6 months
Jar/Cartridge	<10°C	6 months

Solder paste should be allowed to reach ambient working temperature prior to use. Generally, the paste should be removed from refrigeration at least 2 hours before use. The actual time to reach thermal equilibrium will vary with container size. Paste temperature should be verified before use. Jars and cartridges should be labeled with the date and time of opening.

Packaging

Indium10.8HF is currently available in 500g jars or 600g cartridges. Packaging for enclosed print head systems is also readily available. Alternate packaging options may be available upon request.

Printing

Stencil Design:

Electroformed and laser cut/electropolished stencils produce the best printing characteristics among stencil types. Stencil aperture design is a crucial step in optimizing the print process. The following are a few general recommendations:

Discrete components - A 10–20% reduction of stencil aperture has significantly reduced or eliminated the occurrence of mid-chip solder beads. The “home plate” design is a common method for achieving this reduction.
Fine-pitch components - A surface area reduction is recommended for apertures of 20mil pitch and finer. This reduction will help minimize solder balling and bridging that can lead to electrical shorts. The amount of reduction necessary is process-dependent (5–15% is common).
For optimum transfer efficiency and release of the solder paste from the stencil apertures, industry standard aperture and aspect ratios should be adhered to.

Cleaning

Indium10.8HF is designed for no-clean applications; however, the flux can be removed, if necessary, by using a commercially available flux residue remover

Stencil Cleaning is best performed using isopropyl alcohol (IPA) as a solvent. Most commercially available non-water-based stencil cleaners work well.