Indium 8.9HF Pb-Free Solder Paste - SAC305, T4 (88.5 Percent), 500g Jars
Indium 8.9HF
Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HF offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9HF minimizes false failures in ICT. It is one of our lowest voiding pastes.
Complementary Products
- Rework Flux: TACFlux 089HF, TACFlux 020B-RC
- Cored Wire: CW-807, Core 230-RC
- Wave Flux: WF-9945, WF-9958
Avoid the Void
Avoid shortened product life; avoid field failures; avoid customer dissatisfaction, plus a whole lot more with Indium Corporation’s advanced solder paste technology.
Indium Corporation’s suite of solder pastes offers formulations designed to deliver low-voiding, plus enhanced benefits such as improved response-to-pause, stability, HiP minimization, reliable in-circuit testing, and enhanced SIR performance.