• Quantity: 25g in a 30cc syringe
• Low-viscosity thixotropic no-clean flux designed for use in ball attachment to substrates (BGA manufacturing)
• Suitable for pin grid array and standard ball grid array applications
• Airless packaging
• Excellent solderability to all common surface metallizations

NC-506 Ball-attach Flux

NC-506 Ball-Attach Flux is a low-viscosity thixotropic no-clean flux designed for use in ball-attachment to substrates (BGA manufacturing). It is especially useful in applications requiring soldering to surface finishes with tenacious oxides, such as nickel. It can also be used wherever a no-clean ball-attach flux is needed, and is suitable for a variety of different deposition methods.

Ball-Attach Flux

The ball-attach process can be considered a trivial step when creating a BGA or similar package, but the final soldering step can be rather complex.

There are several variables that impact the final ball-attach performance from a number of assembly processes carried out before that. These processes can be a key factor in the final yield of the BGA.

The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the entire assembly is reflowed. BGA fluxes are usually water-soluble, while PGA fluxes are often no-clean materials.

Pin transfer volumes can be optimized by changing equipment parameters. Key variables of pin transfer include pin shape, pin diameter, shear speed, dwell, and depth of immersion.

NC-506 is designed for no-clean applications. If necessary, the flux can be removed by using a commercially available flux cleaner. Please contact an Indium Corporation Technical Support Engineer for recommendations of cleaners to suit your process needs.

NC-506 syringes and cartridges should be stored tip down at ≤30°C for maximum shelf life. After removing from cold storage, NC-506 should be allowed to stand for a minimum of 4 hours at room temperature before using.