• Quantity: 25g in a 30CC syringe
• No-clean flux formulated for SnAgCu and AnAg solders (also compatible with Sn/Pb solder)
• TACFlux 089HF provides excellent wetting in air or nitrogen atmospheres
• The flux and flux reside is halogen-free
• Flux type classification: ROL0

TACFlux 089HF is a no-clean flux formulated for SnAgCu and SnAg solders (also compatible with Sn/Pb solder). TACFlux 089HF provides excellent wetting in air or nitrogen atmospheres. The flux and flux residue is halogen-free.

Cleaning

TACFlux 089HF is designed for no-clean applications. If necessary, the flux can be removed by using a commercially available flux cleaner.

Reflow

Peak reflow temperature should be <260°C in an air or nitrogen atmosphere.

Storage

TACFlux 089HF syringes and cartridges should be stored tip down at 0–30°C. If refrigerated, TACFlux 089HF should be thawed for 4 hours at room temperature before using.