Indium 5.1 PB-Free Solder Paste - SAC305, T3 (89 Percent), 600g Cartridge
Indium5.1 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other Pb-free alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today’s high-speed, as well as high-mix, surface mount lines. In addition to consistent printing and reflow requirements, this paste offers superb wetting to Pb-free metallizations in combination with clear residue and low-voiding on microvia.
Storage and Handling Procedures
Refrigerated storage will prolong the shelf life of solder paste. The shelf life of Indium5.1 is 6 months when stored at <5°C. Solder paste packaged in syringes and cartridges should be stored tip down.
Solder paste should be allowed to reach ambient working temperature prior to use. Generally, the paste should be removed from refrigeration at least 2 hours before use. The actual time to reach thermal equilibrium will vary with container size. Paste temperature should be verified before use. Jars and cartridges should be labeled with the date and time of opening.
Cleaning
Indium 5.1 is designed for no-clean applications; however, the flux can be removed, if necessary, by using a commercially available flux residue remover.
Stencil Cleaning is best performed using isopropyl alcohol (IPA) as a solvent. Most commercially available stencil cleaners work well.
Compatible Products
- Rework Flux: TACFlux 020B