• Alloy: SAC305
• Type 3 powder (89 percent metal load)
• Quantity: 500g jar
• Ultra-low flux spattering (ideal for applications with Au finger connectors)
• Ultra-low solder beading 

Lead-Free Solder Paste Features & Benefits

Indium Corporation’s Pb-free solder pastes are ideal for miniaturized components and fine-pitch assembly. They provide first-class printing and robust reflow performance and are all designed to AVOID THE VOID.

Indium 5.8LS

Indium5.8LS is a halide-free, no-clean solder paste specifically formulated for low flux spatter. This material is designed to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other Pb-free alloy systems in an air or nitrogen reflow atmosphere. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today’s high speed as well as high mix surface mount lines.

Avoid the Void

Avoid shortened product life; avoid field failures; avoid customer dissatisfaction, plus a whole lot more with Indium Corporation’s advanced solder paste technology.

Indium Corporation’s suite of solder pastes offers formulations designed to deliver low-voiding, plus enhanced benefits such as improved response-to-pause, stability, HiP minimization, reliable in-circuit testing, and enhanced SIR performance.

Standard packaging for stencil printing applications includes 4oz jars and 6 or 12oz cartridges. Packaging for enclosed print head systems is also readily available. For dispensing applications, 10 and 30cc syringes are standard. Other packaging options may be available upon request.

Storage and Handling Procedures

Refrigerated storage is recommended throughout the shelf life of solder paste. The shelf life of Indium5.8LS is 6 months when stored at <10°C. Store syringes and cartridges tip down.

Remove solder paste from refrigeration at least 2 hours before use to allow the solder paste to reach an ambient working temperature. As the time to reach thermal equilibrium will vary with container size, verify solder paste temperature prior to use. Label jars and cartridges with the date and time of opening.

Compatible Products

• Rework Flux: TACFlux 018
• Cored Wire: CW-807
• Wave Flux: WF-9945, WF-9958

Printing

Stencil Design:

Electroformed and laser cut/electropolished stencils produce the best printing characteristics among stencil types. Stencil aperture design is a crucial step in optimizing the print process. The following are a few general recommendations:

• Discrete components-A 10-20% reduction of stencil aperture has significantly reduced or eliminated the occurrence of mid-chip solder beads. The “home plate” design is a common method for achieving this reduction.
• Fine-pitch components-A surface area reduction is recommended for apertures of 20mil pitch and finer. This reduction will help minimize solder balling and bridging that can lead to electrical shorts. The amount of reduction necessary is process-dependent (5-15% is common).
• For adequate release of solder paste from stencil apertures, a minimum aspect ratio of 1:5 is required. The aspect ratio is defined as the width of the aperture divided by the thickness of the stencil.

Cleaning

Indium5.8LS is designed for no-clean applications; however, the flux can be removed, if necessary, by using a commercially available flux residue remover.

Stencil Cleaning: This is best performed using isopropyl alcohol (IPA) as a solvent. Most commercially available stencil cleaners work well.