Indium 10.1 Pb-Free Solder Paste - SAC305, T5 (83 Percent); 100g Syringe
Lead-Free Solder Paste Features & Benefits
As a leader in soldering technology, Indium Corporation offers a number of solder pastes for Pb-free assembly. We offer many different alloy choices and flux technologies to solve many of your process challenges.
Indium Corporation’s Pb-free solder pastes are ideal for miniaturized components and fine-pitch assembly. They provide first-class printing and robust reflow performance and are all designed to AVOID THE VOID®.
Indium 10.1
Indium10.1 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu and other Pb-free alloy systems favored by the electronics industry to replace Pb-bearing solders. Indium10.1 offers exceptional stencil print transfer efficiency to work in the broadest range of processes. In addition, the high oxidation resistance of Indium10.1 virtually eliminates incomplete coalescence (graping) of small deposits and the head-in-pillow defect. Indium10.1 also offers extremely low, large ground-plane voiding found in QFN components.
Storage and Handling Procedures
Refrigerated storage will prolong the shelf life of solder paste. Solder paste packaged in cartridges should be stored tip down.
Solder paste should be allowed to reach ambient working temperature prior to use. Generally, paste should be removed from refrigeration at least 2 hours before use. Actual time to reach thermal equilibrium will vary with container size. Paste temperature should be verified before use. Jars and cartridges should be labeled with date and time of opening.
Printing
Stencil Design:
Electroformed and laser cut/electropolished stencils produce the best printing characteristics among stencil types. Stencil aperture design is a crucial step in optimizing the print process. The following are a few general recommendations:
- Discrete components—A 10–20% reduction of stencil aperture has significantly reduced or eliminated the occurrence of mid-chip solder beads. The “home plate” design is a common method for achieving this reduction.
- Fine-pitch components—A surface area reduction is recommended for apertures of 20mil pitch and finer. This reduction will help minimize solder balling and bridging that can lead to electrical shorts. The amount of reduction necessary is process dependent (5–15% is common).
- For optimum transfer efficiency and release of the solder paste from the stencil apertures, industry standard aperture and aspect ratios should be adhered to.
Cleaning
Indium10.1 is designed for no-clean applications; however, the flux can be removed, if necessary, by using a commercially available flux residue remover.
Stencil Cleaning is best performed using isopropyl alcohol (IPA) as a solvent. Most commercially available non-water-based stencil cleaners work well..