Indium 801218 - Solder Paste, Water Soluble, Leaded, T3, 89.8%, Sn63/Pb37, 500g Jar

Name: Indium 801218 - Solder Paste, Water Soluble, Leaded, T3, 89.8%, Sn63/Pb37, 500g Jar
Brand: Indium
SKU: Indium801218
Availability: InStock

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Solder Paste, Water Soluble, Leaded, T3, 89.8%, Sn63/Pb37, 500g Jar

Lowest voiding water-soluble flux for solder paste
Exceptional printing process window
Wide reflow process window for profiling
Excellent wetting on a variety of surface finishes
Maintains tack over time
Suitable for SnPb eutectic alloys as well as Pb-free alloys

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Product	Indium 801218 Solder Paste, Water Soluble, Leaded, T3, 89.8%, Sn63/Pb37, 500g Jar	Indium PASTEOT-801215 6.4R water-soluble Pb-free solder paste; SAC305; Type 4 (89.5 percen ...	Indium PASTEOT-801217 6.4RT water-soluble SnPB solder paste; Sn63/Pb37; Type 4 (89.5 perce ...	Indium 801215-5006 6.4R 6.4R water-soluble Pb-free and SnPb solder paste; SAC305; Type 4 ( ...	Indium 801216 Solder Paste, Water Soluble, Lead-Free, T3, 88.8%, SAC305, 500g Jar-Note:Pri ...	Indium 801217-500G Solder Paste, Water Soluble, Leaded, T4, 89.5%, Sn63Pb37, 500g Jar-Note ...	Indium 801217-700G Solder Paste, Water Soluble, Leaded, T3, 89.5%, Sn63Pb37, 700g Cart-Not ...
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Alloy Type	Sn63/Pb37	SAC305	Sn63/Pb37	SAC305	SAC305	Sn63/Pb37	Sn63/Pb37
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Indium 801218 - Solder Paste, Water Soluble, Leaded, T3, 89.8%, Sn63/Pb37, 500g Jar

Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This solder paste provides exceptional stencil printing performance, with long stencil life and excellent response to pause.

Indium6.4R exhibits superior wetting to a variety of surface finishes and exhibits the best voiding performance, with the fewest voids, reduced size of largest voids, and overall minimized voiding for BGAs, CSPs, and BTCs (QFNs, DPAKs, LGAs, etc.).